说明
无说明配置
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
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OXFORD
PLASMALAB 100
已验证
类别
PECVD
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116992
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100
类别
PECVD
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116992
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
无文件