说明
Substrate Surface Mount (Passive Component, Boat) [oS]配置
无配置OEM 型号描述
The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.文件
无文件
类别
Pick and Place
上次验证： 25 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
151384
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT / SIEMENS
SIPLACE CA
类别
Pick and Place
上次验证： 25 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
151384
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Substrate Surface Mount (Passive Component, Boat) [oS]配置
无配置OEM 型号描述
The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.文件
无文件