跳至主要内容
Moov logo

Moov Icon
PANASONIC DT401
    说明
    NOZZLE
    配置
    无配置
    OEM 型号描述
    The Panasonic DT401 is a highly versatile and efficient pick and place machine that can handle a wide range of components. It has a placement accuracy of ±50 µm/Chip (Cpk1) for chips and ±35 µm/QFP (Cpk1) for trays. It can handle parts ranging from microchips to large parts such as BGAs, CSPs and connectors. The DT401 is designed to give users the flexibility to place a large number of varied, odd-shaped components at high speeds. It can handle a broad spectrum of components including 0402 chips, BGAs, CSPs, connectors and other large components up to 100 mm X 90 mm @ 25mm thickness.
    文件

    无文件

    类别
    Pick and Place

    上次验证: 25 天前

    物品主要详细信息

    状况:

    Parts Tool


    运行状况:

    未知


    产品编号:

    129593


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    PANASONIC

    DT401

    verified-listing-icon
    已验证
    类别
    Pick and Place
    上次验证: 25 天前
    listing-photo-43c1ffbf9fa64d80b8540fea1672ecca-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53484/43c1ffbf9fa64d80b8540fea1672ecca/3b6eab69d2f244e2be531a29caa686e3_screenshot20250617171758_mw.png
    物品主要详细信息

    状况:

    Parts Tool


    运行状况:

    未知


    产品编号:

    129593


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    NOZZLE
    配置
    无配置
    OEM 型号描述
    The Panasonic DT401 is a highly versatile and efficient pick and place machine that can handle a wide range of components. It has a placement accuracy of ±50 µm/Chip (Cpk1) for chips and ±35 µm/QFP (Cpk1) for trays. It can handle parts ranging from microchips to large parts such as BGAs, CSPs and connectors. The DT401 is designed to give users the flexibility to place a large number of varied, odd-shaped components at high speeds. It can handle a broad spectrum of components including 0402 chips, BGAs, CSPs, connectors and other large components up to 100 mm X 90 mm @ 25mm thickness.
    文件

    无文件