说明
20 Misc. Feeders Included配置
11513 HoursOEM 型号描述
The Assembleon Opal-XII is a well-regarded pick and place machine known for its excellent condition and available feeders. It boasts a placement rate of 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) and 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads). The machine is capable of handling components ranging in size from 01005 (0402) to 45 mm sq. (1.8” sq.) and has a fine pitch accuracy of 35 microns @ 3 sigma. The Opal-XII is essentially a more compact version of the Topaz-XII, with slightly lower component output but the same placement accuracy and board size. Both systems are capable of placing everything from small 01005 components to large CSPs, Flip Chips, BGAs, and fine pitch QFPs.文件
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PHILIPS / ASSEMBLEON
OPAL-XII
已验证
类别
Pick and Place
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
54500
晶圆尺寸：
未知
年份：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PHILIPS / ASSEMBLEON
OPAL-XII
类别
Pick and Place
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
54500
晶圆尺寸：
未知
年份：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
20 Misc. Feeders Included配置
11513 HoursOEM 型号描述
The Assembleon Opal-XII is a well-regarded pick and place machine known for its excellent condition and available feeders. It boasts a placement rate of 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) and 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads). The machine is capable of handling components ranging in size from 01005 (0402) to 45 mm sq. (1.8” sq.) and has a fine pitch accuracy of 35 microns @ 3 sigma. The Opal-XII is essentially a more compact version of the Topaz-XII, with slightly lower component output but the same placement accuracy and board size. Both systems are capable of placing everything from small 01005 components to large CSPs, Flip Chips, BGAs, and fine pitch QFPs.文件
无文件