说明
Plasma DRIE Etch Equipment, Deep Silicon Etch, EndPoint, Mag 7配置
Tool Configuration: - Brooks Platform - Dual Loadlocks - Magnatron 7 - Alcatel ACT 600M TMP Turbo - User Interface PC - Transfer PC Process Chamber: AMS X200 - Alcatel ACT 1300M TMP Turbo Process Gases: - SF6 1000sccm - C4F8 400sccm - O2 100sccm - O2 800sccm - Ar 200sccm - N2 1000sccm - Ar - CHF3 EDM - CS200-11729 - 200/208VAC, 3 Phase, 50/60Hz Alcatel AMS X200 - CE Marked - Qty 2 - SEMCO HV52000C - SEREN L301 RF - Advanced Energy Dressler Cesar RF - ENI Spectrum B-3013 RF - 208VAC, 3 Phase, 50/60HzOEM 型号描述
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PFEIFFER / ALCATEL / ADIXEN
AMS 4200
已验证
类别
Plasma Etch
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
31911
晶圆尺寸:
未知
年份:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部PFEIFFER / ALCATEL / ADIXEN
AMS 4200
类别
Plasma Etch
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
31911
晶圆尺寸:
未知
年份:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Plasma DRIE Etch Equipment, Deep Silicon Etch, EndPoint, Mag 7配置
Tool Configuration: - Brooks Platform - Dual Loadlocks - Magnatron 7 - Alcatel ACT 600M TMP Turbo - User Interface PC - Transfer PC Process Chamber: AMS X200 - Alcatel ACT 1300M TMP Turbo Process Gases: - SF6 1000sccm - C4F8 400sccm - O2 100sccm - O2 800sccm - Ar 200sccm - N2 1000sccm - Ar - CHF3 EDM - CS200-11729 - 200/208VAC, 3 Phase, 50/60Hz Alcatel AMS X200 - CE Marked - Qty 2 - SEMCO HV52000C - SEREN L301 RF - Advanced Energy Dressler Cesar RF - ENI Spectrum B-3013 RF - 208VAC, 3 Phase, 50/60HzOEM 型号描述
未提供文件
无文件