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ACCRETECH / TSK UF200
    说明
    无说明
    配置
    Number of Cassette Elevators 2 Wafer Handling Random Access Robot Accuracy ± 2.00 % Vacuum Chuck -Diameter 7.8740 in (200.00 mm) -Plating Material Nickel/Gold -Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)
    OEM 型号描述
    The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.
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    ACCRETECH / TSK

    UF200

    verified-listing-icon

    已验证

    类别
    Probers

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101933


    晶圆尺寸:

    6"/150mm, 8"/200mm


    年份:

    1998

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    类似上架物品
    查看全部
    ACCRETECH / TSK UF200

    ACCRETECH / TSK

    UF200

    Probers
    年份: 1999状况: 二手
    上次验证7 天前

    ACCRETECH / TSK

    UF200

    verified-listing-icon
    已验证
    类别
    Probers
    上次验证: 30 多天前
    listing-photo-9b52f09495f24fa1b6bced169ec6be79-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53724/9b52f09495f24fa1b6bced169ec6be79/bdf349e0bd54414cb7a315a7b277d48e_43769cc981c84208b81572f26b5dbfb71201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101933


    晶圆尺寸:

    6"/150mm, 8"/200mm


    年份:

    1998


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    Number of Cassette Elevators 2 Wafer Handling Random Access Robot Accuracy ± 2.00 % Vacuum Chuck -Diameter 7.8740 in (200.00 mm) -Plating Material Nickel/Gold -Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)
    OEM 型号描述
    The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.
    文件

    无文件

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