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ACCRETECH / TSK UF200
    说明
    无说明
    配置
    -Number of Cassette Elevators 2 -Wafer Handling - Random Access Robot -Accuracy ± 2.00 % Vacuum Chuck -Diameter 200.0000 in (5,080.00 mm) -Plating Material Nickel/Gold Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions: Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)
    OEM 型号描述
    The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.
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    ACCRETECH / TSK

    UF200

    verified-listing-icon

    已验证

    类别
    Probers

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101930


    晶圆尺寸:

    6"/150mm, 8"/200mm


    年份:

    2000

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    类似上架物品
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    ACCRETECH / TSK UF200

    ACCRETECH / TSK

    UF200

    Probers
    年份: 1999状况: 二手
    上次验证7 天前

    ACCRETECH / TSK

    UF200

    verified-listing-icon
    已验证
    类别
    Probers
    上次验证: 30 多天前
    listing-photo-a5a1e80946594c4f93d891e09a4c48d1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53724/a5a1e80946594c4f93d891e09a4c48d1/e95e3e88f9b340fa8f0ec97b22026520_6091ce5e840c4659be1bc836ae1aba8d1201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101930


    晶圆尺寸:

    6"/150mm, 8"/200mm


    年份:

    2000


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    -Number of Cassette Elevators 2 -Wafer Handling - Random Access Robot -Accuracy ± 2.00 % Vacuum Chuck -Diameter 200.0000 in (5,080.00 mm) -Plating Material Nickel/Gold Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions: Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)
    OEM 型号描述
    The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.
    文件

    无文件

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    查看全部
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