说明
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OCR: Yes Wafer specification Size: 8"/12" Thickness: 240~2200um Die size: 350~76000um Autoloader unit 300 mm FOUP/ FOSB and 200 mm cassette Interface Single port Loader GPIB Chuck Nickel plate Planarity: 15um (20°C≤t ≤50°C) 30um (50°C≤t ≤200°C) Temperature: 30°C to 150°C Withstand Load : 200kgf Display Unit: 15" color display & touch panel Cleaning Unit (100 mm x 60mm) 3 block with vacuum type APC function No Miscellaneous 1. Touch sensor. 2. Ethernet interface. 3. Cognex 8200 Auto hinge No Probe card holder No Touch sensor YesOEM 型号描述
The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.文件
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128849
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
UF3000EX-e
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128849
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available