说明
无说明配置
OCR: Yes Wafer specification: -Size: 8"/12" -Thickness: 240~2200um -Die size: 350~76000um Autoloader unit: -300 mm FOUP/ FOSB and 200 mm cassette -Single port Loader Interface: GPIB Chuck: -Nickel plate -Planarity : 15um (20℃≦t ≦50℃) -30um (50℃≦t ≦200℃) -Temperature : 30℃ to 150℃ -Withstand Load : 200kgf Display Unit: 15” color display & touch panel Cleaning Unit: (100 mm x 60mm) 3 block with vacuum type APC function: No Miscellaneous: 1. Touch sensor 2. Ethernet interface 3. Cognex 8200 Docking interface: VLCT/J750 combo Auto hinge: No Probe card holder: No Touch sensor: YesOEM 型号描述
The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.文件
ACCRETECH / TSK
UF3000EX-e
已验证
类别
Probers
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
71202
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
UF3000EX-e
类别
Probers
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
71202
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available