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ACCRETECH / TSK UF300A
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.
    文件

    无文件

    类别
    Probers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    76396


    晶圆尺寸:

    未知


    年份:

    2002


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    ACCRETECH / TSK

    UF300A

    verified-listing-icon
    已验证
    类别
    Probers
    上次验证: 60 多天前
    listing-photo-305449204e484d8184006e13001142ce-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    76396


    晶圆尺寸:

    未知


    年份:

    2002


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.
    文件

    无文件