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ACCRETECH / TSK UF300A
  • ACCRETECH / TSK UF300A
  • ACCRETECH / TSK UF300A
  • ACCRETECH / TSK UF300A
说明
无说明
配置
无配置
OEM 型号描述
The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.
文件

无文件

类别
Probers

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

76396


晶圆尺寸:

未知


年份:

2002


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ACCRETECH / TSK

UF300A

verified-listing-icon
已验证
类别
Probers
上次验证: 60 多天前
listing-photo-305449204e484d8184006e13001142ce-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

76396


晶圆尺寸:

未知


年份:

2002


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
无配置
OEM 型号描述
The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.
文件

无文件