说明
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask Function配置
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM 型号描述
未提供文件
无文件
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
New
运行状况:
未知
产品编号：
89683
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
AP3000e
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
New
运行状况:
未知
产品编号：
89683
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask Function配置
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM 型号描述
未提供文件
无文件