说明

wafers 12", hot chuck

配置

无配置

OEM 型号描述

The EG6000t: Introduced in July of 2008, the new EG6000t is the second generation of our flagship 300mm wafer prober product line that fuses automation and reliability requirements of high volume manufacturing environments with the highest caliber of prober technology, producing the world’s most accurate 300mm production wafer probers. The EG6000t combines improved probe card finding optics, increased wafer pre-align, cassette loading and mapping speeds together with increased loader pre-alignment accuracy to produce smooth, fast and precise operation. The EG6000t also provides a new generation of overall z accuracy with proprietary grid-based wafer surface mapping and advanced probe-to-pad alignment optics and algorithms. Along with increased z accuracy, when implemented with the MicroTouch feature that allows for precise control of z-stage velocities, it enables the EG6000t to reduce overall damage to aluminum capped copper pads, low k dielectrics, circuitry under pads, in addition to extending the life of probe cards used on the tool during production. These advanced features of the EG6000t are critical elements when probing advanced device technologies.