说明
无说明配置
无配置OEM 型号描述
The P-8XL Prober is a market innovation in the wafer probing industry by TEL. It offers superior accuracy, reliability, efficiency, and integration for the test cell through its features such as on-axis alignment, optical wafer profiling, and direct test head docking. The P-8XL is equipped with a fully interactive LCD Touch Panel Screen and TEL’s advanced On-Axis Alignment System, delivering guaranteed pin-to-pad accuracy. It also offers a range of features to overcome probe floor barriers, including Direct Coupling Test Interfaces, Automatic Probe Card Changers, Clean Air Management Systems, Temperature Controlled Chucks, and many others. With its advanced capabilities, the P-8XL is ready to meet the demands of future device complexity and measurement precision.文件
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TEL / TOKYO ELECTRON
P-8XL
已验证
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
14815
晶圆尺寸：
8"/200mm
年份：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
P-8XL
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
14815
晶圆尺寸：
8"/200mm
年份：
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The P-8XL Prober is a market innovation in the wafer probing industry by TEL. It offers superior accuracy, reliability, efficiency, and integration for the test cell through its features such as on-axis alignment, optical wafer profiling, and direct test head docking. The P-8XL is equipped with a fully interactive LCD Touch Panel Screen and TEL’s advanced On-Axis Alignment System, delivering guaranteed pin-to-pad accuracy. It also offers a range of features to overcome probe floor barriers, including Direct Coupling Test Interfaces, Automatic Probe Card Changers, Clean Air Management Systems, Temperature Controlled Chucks, and many others. With its advanced capabilities, the P-8XL is ready to meet the demands of future device complexity and measurement precision.文件
无文件