说明
vip3 combo350 OCR Detailed Specifications - Rotate location WAPP detailed specifications - Standard Wapp SACC Detailed Specifications - Flip Sacc配置
无配置OEM 型号描述
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.文件
无文件
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
108684
晶圆尺寸：
未知
年份：
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
TEL / TOKYO ELECTRON
P-12XLn+
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
108684
晶圆尺寸：
未知
年份：
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
vip3 combo350 OCR Detailed Specifications - Rotate location WAPP detailed specifications - Standard Wapp SACC Detailed Specifications - Flip Sacc配置
无配置OEM 型号描述
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.文件
无文件