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TEL / TOKYO ELECTRON CELLCIA
  • TEL / TOKYO ELECTRON CELLCIA
  • TEL / TOKYO ELECTRON CELLCIA
  • TEL / TOKYO ELECTRON CELLCIA
说明
Production Wafer Prober
配置
无配置
OEM 型号描述
There are an increasing variety of test requirements in conjunction with diversified device design, device application, process node shrink and package design complexity. To reduce total test cost, especially in Memory applications, multi-site probe cards were introduces as a way of reducing test cost. This method found its limit when single wafer/one-touch-down probe card technology appeared. Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost. TEL has combined its vast wafer probe experience and front-end process technologies to develop the world’s leading probe system, Cellcia™.
文件

无文件

类别
Probers

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

117925


晶圆尺寸:

12"/300mm


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

TEL / TOKYO ELECTRON

CELLCIA

verified-listing-icon
已验证
类别
Probers
上次验证: 60 多天前
listing-photo-be19f66e84c741538f057f4d7d13441b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

117925


晶圆尺寸:

12"/300mm


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Production Wafer Prober
配置
无配置
OEM 型号描述
There are an increasing variety of test requirements in conjunction with diversified device design, device application, process node shrink and package design complexity. To reduce total test cost, especially in Memory applications, multi-site probe cards were introduces as a way of reducing test cost. This method found its limit when single wafer/one-touch-down probe card technology appeared. Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost. TEL has combined its vast wafer probe experience and front-end process technologies to develop the world’s leading probe system, Cellcia™.
文件

无文件