概述

The Tencor HRP-200 High-Resolution Profiler is a fully-automated system that provides global and local analysis of wafer surface topography. It can measure surface topography on both macroscopic and microscopic scales, combining long scans with fine-area analysis of submicron features. It allows process engineers to quickly compare feature depths and relative surface heights. It also combines the measurement repeatability and ease of use of a Tencor stylus profiler with the high-resolution analysis and imaging capabilities of an Atomic Force Microscope (AFM).