说明
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)配置
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 PaOEM 型号描述
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文件
无文件
ASM
EAGLE XP
已验证
类别
ALD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
53755
晶圆尺寸：
12"/300mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XP
类别
ALD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
53755
晶圆尺寸：
12"/300mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)配置
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 PaOEM 型号描述
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文件
无文件