We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
无说明配置
Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Missing/ Faulty Parts/ Accessories List: Throttle Valve 1 HF Generator 1 (Generator replaced)OEM 型号描述
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文件
无文件
PREFERRED
SELLER
ASM
EAGLE XP
类别
ALD
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
67819
晶圆尺寸：
12"/300mm
年份：
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Missing/ Faulty Parts/ Accessories List: Throttle Valve 1 HF Generator 1 (Generator replaced)OEM 型号描述
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文件
无文件