说明

TiN BS

配置

Loading Configuration - 3 Loadport Chamber E - Dual Mode Degas Chamber F - Dual Mode Degas Chamber 1 - RF PVD TiN LP Chamber 2 - RF PVD TiN LP Chamber 3 - RF PVD TiN LP Chamber 1/2/3 Chemicals/Gases Used - N2/Ar Chamber E, F Chemicals/Gases Used - Ar N2 Load Port Exists 1 - No N2 Load Port Exists 2 - No

OEM 型号描述

The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.