说明

Metal Barrier Deposition Platform Mainframe (7,334 lb) · Factory Interface (3,692 lb) Details Attached

配置

Metal PVD Chambers can support the PVD Cu barrier process directionality unit for sub-5nm contact/via fill (Sputters into contacts & vias ≤ 5nm) Degas chambers are intact (eSIP TaN · Tin –Multiple Degas) PVD Cu Barrier Directional eSIP TaN (barrier/seed) Mainframe (7,334 lb) · Factory Interface (3,692 lb) Chamber positions 1, 2, 3, E, F · XP motion controller Cryo compressor · DI cooler · Main AC · System AC 3×equipment racks · fusebox · transformer · crane jibs

OEM 型号描述

Endura systems revolutionized semiconductor metallization by delivering breakthrough technologies and levels of reliability, serviceability and flexibility that far surpassed existing capabilities