说明
Missing Parts: Mg Rotation Assembly, DC Cable, RF Cable, ESC, Sputter DC Power Supply, Dry Pump, BEC Terminal, Mg Motor, Magnet, Lift Cylinder Set, Matching Box,RF power supply, turbo controller配置
Sputter ETCH × 2 channels, SIP-Ti × 3 channelsOEM 型号描述
Applied Materials, Inc.SL has been introduced, a new generation of Applied Materials, Inc.PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands the family of products to provide customers with a complete offering of PVD solutions. The system, which is available with several PVD aluminum and barrier layer process chambers, uses two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. The system is designed to conform to the latest communications and facility standards, and is available with factory automation capability.文件
无文件
类别
PVD / Sputtering
上次验证： 14 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
143506
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA SL PVD
类别
PVD / Sputtering
上次验证： 14 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
143506
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Missing Parts: Mg Rotation Assembly, DC Cable, RF Cable, ESC, Sputter DC Power Supply, Dry Pump, BEC Terminal, Mg Motor, Magnet, Lift Cylinder Set, Matching Box,RF power supply, turbo controller配置
Sputter ETCH × 2 channels, SIP-Ti × 3 channelsOEM 型号描述
Applied Materials, Inc.SL has been introduced, a new generation of Applied Materials, Inc.PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands the family of products to provide customers with a complete offering of PVD solutions. The system, which is available with several PVD aluminum and barrier layer process chambers, uses two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. The system is designed to conform to the latest communications and facility standards, and is available with factory automation capability.文件
无文件