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说明
UBM DEP配置
无配置OEM 型号描述
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)文件
无文件
类别
PVD / Sputtering
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127983
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 300
类别
PVD / Sputtering
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127983
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
UBM DEP配置
无配置OEM 型号描述
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)文件
无文件