ULVAC

CERAUS ZX 1000

SME-200J

The CERAUS Zi-1000 is a high cost-performance metalization system designed for multi-layer wiring applications. It offers a productive configuration by optimizing itself for various processes, including high directional barrier metal sputtering, Al flow sputtering, and copper flow technology. This makes it an efficient and cost-effective solution for metalization needs. 

CERAUS ZI 1000

SIV-500	

STD-1500VR

SRH-420MC

The SIV inline system is a PVD tool that can deposit LCO, LPO and ITO onto panels with a substrate size of up to 1,000mm x 1,000mm. The maximum substrate size is 500mm. It has an RTA module integrated and a special designed chamber for LCO and LPO deposition. The tool is equipped with a special cathode for particle reduction and can deliver high quality/density LCO/LPO target. The system can perform pass-by or continuous deposition and can also deposit ITO.

SIV-200S

SMD-1800X

SDH-4550L

SMD 450C

SH-350H

SMD-650C

Z-1000

SCH-135T

SME-200

SCH-135A

ENTRON

SV-4540

SIH-300RD	

SPW-020

SRH-530

MPS-2000-C8

CERAUS Z-1000

SH-450

SH-700M-C12

MPS-6000-C4S1

IBS-6000

SX-400

SRH-420

SME-200U

MAGEST S200

ULDIS-903CHL

MLK-3000N

SH-450-C10

SV-9045

SH-700L-C16

SRH-420z

ULDIS-200UCP

SIV-3545

SIH-3040

SRH 820

MPS-4000-L4(SP)

SPZ-1000

Ulvac: Ceraus Z-2000 cluster tool, very high vacuum (5e-9), aluminum and barrier metal applications, can be clustered to tungsten CVD system for integrated PVD/CVD applications.

CERAUS Z-2000

SH-100B

The CS-200 is a sputtering system equipped with a 4-inch Magnetron cathode for various target materials. It is suitable for research and development, as well as small and medium-scale volume production. The system is designed for high-performance and high reliability sputtering, based on ULVAC’s extensive experience and sputtering technology portfolio. It is an ideal choice for those looking for a reliable and versatile sputtering system.

CS-200

SPW-030

SV-9040

MPS-2000-HC2

MPS-2000

SH-350-D06

The MLX-3000N is a multi-chamber sputtering system that offers a flexible modular configuration with up to 5 process chambers and a random access robotic wafer transfer. It includes a unique dual pole, electromagnetic sputter source, a low damage high-rate etch-cleaning, and a new wafer heating method. These features, combined with improved process technology for R&D production, make the MLX-3000N a flexible and versatile system for various applications.

MLX-3000N

SME-200E

SV-9040-T14

MUE-ECO

SH-450 SPECIAL TYPE 

ULTECH-4543

BC6643

Standard exhaust system: 12” Cryopump
Ultimate pressure: 6.7e-5Pa
Depot direction: side
Deposition Area Uniformity Stationary Rotation: L300mm±10%	

SV-6040

SMD-450

ULVAC

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热门 ULVAC PVD / Sputtering

CERAUS ZX 1000

SME-200J

CERAUS ZI 1000

SIV-500

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