说明
Macro-Defect配置
无配置OEM 型号描述
The new generation LDS3300 from Vistec Semiconductor Systems (previously Leica Microsystems Semiconductor GmbH) enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.文件
无文件
类别
Reticle / Mask Inspection
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
135209
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / VISTEC / LEICA
LDS3300
类别
Reticle / Mask Inspection
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
135209
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Macro-Defect配置
无配置OEM 型号描述
The new generation LDS3300 from Vistec Semiconductor Systems (previously Leica Microsystems Semiconductor GmbH) enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.文件
无文件