说明
Pictures attached were taken before tool was crated.配置
无配置OEM 型号描述
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.文件
无文件
SEMILAB / SDI
FAAST 230 DP+SPV
已验证
类别
Reticle / Mask Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled / Crated
产品编号：
27530
晶圆尺寸：
未知
年份：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMILAB / SDI
FAAST 230 DP+SPV
类别
Reticle / Mask Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled / Crated
产品编号：
27530
晶圆尺寸：
未知
年份：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Pictures attached were taken before tool was crated.配置
无配置OEM 型号描述
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.文件
无文件