说明
无说明配置
Mark II Sput Etch Chamber (chamber only) Process Kits: – 0020-10518 Pedestal – 3690-01364 Graphite Ring – 0200-09086 Pedestal QTZ Ring – 0020-09933 GDP Anodized Aluminum Turbo : Seiko-Seiki Edwards STP301CVB Match Box: 0010-09416OEM 型号描述
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.文件
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APPLIED MATERIALS (AMAT)
P5000 ETCH
已验证
类别
RIE
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68081
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
P5000 ETCH
类别
RIE
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68081
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Mark II Sput Etch Chamber (chamber only) Process Kits: – 0020-10518 Pedestal – 3690-01364 Graphite Ring – 0200-09086 Pedestal QTZ Ring – 0020-09933 GDP Anodized Aluminum Turbo : Seiko-Seiki Edwards STP301CVB Match Box: 0010-09416OEM 型号描述
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.文件
无文件