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TEGAL 903E
    说明
    无说明
    配置
    -Handles 3”(75mm), 4”(100mm), 5”(125mm), 6”(150mm) Silicon. -TTW (Through The Wall) -Config with listings photos attached below
    OEM 型号描述
    The Tegal 903e is an inline RIE/plasma production etcher configured for six-inch wafers. It is a single-wafer, cassette-to-cassette driven tool with easy-to-use menu control and a 13.56 MHz RF Generator. The input gases are controlled by MFC, with up to 4 MFCs in the system. This tool implements multi-step etch recipes using multiple process gases and has been optimized for specific etches of specific films. Gases available in this configuration are N2, O2, SF6, CHF3, and He. The Tegal 903e plasma dry etch equipment is used by the semiconductor industry for integrated circuit fabrication. It is an industry standard in single-wafer dry etch of silicon nitride, polysilicon, amorphous silicon, and silicon oxide. Wafers are transported to a reaction chamber utilizing a non-friction spatula wafer transport mechanism. A gas mixture is introduced into the Reaction Chamber and becomes reactive by the application of radio frequency (RF) electromagnetic radiation. The reactive mixture, or plasma, etches away material that is not covered by the masking photoresist. The etch process is terminated by time (a parameter specified in the recipe), the wafer is unloaded from the reaction chamber, and a new wafer is introduced repeating the cycle until all wafers have been processed.
    文件

    TEGAL

    903E

    verified-listing-icon

    已验证

    类别
    RIE

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    71311


    晶圆尺寸:

    4"/100mm, 5"/125mm, 6"/150mm


    年份:

    未知

    Have Additional Questions?
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    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
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    类似上架物品
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    TEGAL 903E

    TEGAL

    903E

    RIE
    年份: 0状况: 二手
    上次验证60 多天前

    TEGAL

    903E

    verified-listing-icon
    已验证
    类别
    RIE
    上次验证: 60 多天前
    listing-photo-d17447e4a07d4894996d428b252aca3e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/d17447e4a07d4894996d428b252aca3e/035a347c13b748eab9c98728777e24fb_9a822fcad4c34cc882bb1c4fea321a821201a_mw.jpeg
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    listing-photo-d17447e4a07d4894996d428b252aca3e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/d17447e4a07d4894996d428b252aca3e/28ff87bb5b2a43b5afc5f7a4670a5604_cd1d1a6fa8d447eeb993792ad7f85c83_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    71311


    晶圆尺寸:

    4"/100mm, 5"/125mm, 6"/150mm


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    -Handles 3”(75mm), 4”(100mm), 5”(125mm), 6”(150mm) Silicon. -TTW (Through The Wall) -Config with listings photos attached below
    OEM 型号描述
    The Tegal 903e is an inline RIE/plasma production etcher configured for six-inch wafers. It is a single-wafer, cassette-to-cassette driven tool with easy-to-use menu control and a 13.56 MHz RF Generator. The input gases are controlled by MFC, with up to 4 MFCs in the system. This tool implements multi-step etch recipes using multiple process gases and has been optimized for specific etches of specific films. Gases available in this configuration are N2, O2, SF6, CHF3, and He. The Tegal 903e plasma dry etch equipment is used by the semiconductor industry for integrated circuit fabrication. It is an industry standard in single-wafer dry etch of silicon nitride, polysilicon, amorphous silicon, and silicon oxide. Wafers are transported to a reaction chamber utilizing a non-friction spatula wafer transport mechanism. A gas mixture is introduced into the Reaction Chamber and becomes reactive by the application of radio frequency (RF) electromagnetic radiation. The reactive mixture, or plasma, etches away material that is not covered by the masking photoresist. The etch process is terminated by time (a parameter specified in the recipe), the wafer is unloaded from the reaction chamber, and a new wafer is introduced repeating the cycle until all wafers have been processed.
    文件
    类似上架物品
    查看全部
    TEGAL 903E

    TEGAL

    903E

    RIE年份: 0状况: 二手上次验证: 60 多天前
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    RIE年份: 0状况: 二手上次验证: 14 天前
    TEGAL 903E

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    903E

    RIE年份: 0状况: 二手上次验证: 60 多天前