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APPLIED MATERIALS (AMAT) CENTURA RTP XE Plus
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Centura RTP XE is a market-leading thermal processing tool that has recently been enhanced to create the new RTP XEplus Centura. This new version offers increased throughput and new application capabilities, including the ability to perform ultra-shallow junction formation using the Implant xR LEAP™ and RTP XEplus Centura. In addition to the RTP XEplus Centura, there are several other LPCVD product offerings available, including the Poly Centura, DCS xZ™ tungsten silicide chamber, and the Polycide xZ Centura for cost-effective integrated tungsten silicide and poly processing. For capacitor solutions, the recently-introduced Tanox xZ Centura offers high-productivity tantalum oxide deposition. These tools provide a range of options for thermal processing and other applications in semiconductor manufacturing.
    文件

    无文件

    类别
    RTP/RTA

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    119303


    晶圆尺寸:

    8"/200mm


    年份:

    2003


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    APPLIED MATERIALS (AMAT)

    CENTURA RTP XE Plus

    verified-listing-icon
    已验证
    类别
    RTP/RTA
    上次验证: 60 多天前
    listing-photo-108c4f0157c0407aaac777708ab852e0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    119303


    晶圆尺寸:

    8"/200mm


    年份:

    2003


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Centura RTP XE is a market-leading thermal processing tool that has recently been enhanced to create the new RTP XEplus Centura. This new version offers increased throughput and new application capabilities, including the ability to perform ultra-shallow junction formation using the Implant xR LEAP™ and RTP XEplus Centura. In addition to the RTP XEplus Centura, there are several other LPCVD product offerings available, including the Poly Centura, DCS xZ™ tungsten silicide chamber, and the Polycide xZ Centura for cost-effective integrated tungsten silicide and poly processing. For capacitor solutions, the recently-introduced Tanox xZ Centura offers high-productivity tantalum oxide deposition. These tools provide a range of options for thermal processing and other applications in semiconductor manufacturing.
    文件

    无文件