概述

The 2900 RTP system addresses 0.25-0.13 micron RTP applications at, what STEAG believes to be, the best cost of ownership in the industry. It incorporates the advanced capabilities of the 3000 RTP tool and the field proven capabilities of the 2800 and 8800 systems. Applications include silicide/barrier formation, BPSG reflow and densification, thin gate dielectrics, thermal donor annihilation and multilayer annealing.