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MATTSON / STEAG / AST HEATPULSE  2101
  • MATTSON / STEAG / AST HEATPULSE  2101
  • MATTSON / STEAG / AST HEATPULSE  2101
  • MATTSON / STEAG / AST HEATPULSE  2101
说明
Rapid Thermal Processing System for 3 Applications: Implant Activation, Silicide Formation, Oxide Reflow (PSG & BPSG), Alloying Cassette to Cassette Handling of 3”-5” Wafers Microprocessor-controlled 60-100 Wafers per Hour Throughput, Depending on Anneal Cycle 400-1150ºC Steady-State Temperature Range 1-300 Seconds Anneal Time Controlled Ambient for up to 4 Gases
配置
无配置
OEM 型号描述
未提供
文件

无文件

类别
RTP/RTA

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

16249


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

MATTSON / STEAG / AST

HEATPULSE 2101

verified-listing-icon
已验证
类别
RTP/RTA
上次验证: 60 多天前
listing-photo-ERbolUfIA_denbaNmr7cCSPAFGCuvgdJgdLTxkqHa6Q-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/ERbolUfIA_denbaNmr7cCSPAFGCuvgdJgdLTxkqHa6Q/0qcDqzRkf3-ztVZnYijB97cMmFUc22yWxRY-gVjhD7o_20190315_091655_f
listing-photo-ERbolUfIA_denbaNmr7cCSPAFGCuvgdJgdLTxkqHa6Q-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/ERbolUfIA_denbaNmr7cCSPAFGCuvgdJgdLTxkqHa6Q/z9wNnuKXgMFjUJtFxAxpLp_y9OrSIS3SXLBiX_WMRJ4_20190315_091655_f
listing-photo-ERbolUfIA_denbaNmr7cCSPAFGCuvgdJgdLTxkqHa6Q-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/ERbolUfIA_denbaNmr7cCSPAFGCuvgdJgdLTxkqHa6Q/IfjzAY1YDgq1Af_Ky8RpsgsYhudtRwO79gkSdj9FMiQ_20190315_091655_f
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

16249


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Rapid Thermal Processing System for 3 Applications: Implant Activation, Silicide Formation, Oxide Reflow (PSG & BPSG), Alloying Cassette to Cassette Handling of 3”-5” Wafers Microprocessor-controlled 60-100 Wafers per Hour Throughput, Depending on Anneal Cycle 400-1150ºC Steady-State Temperature Range 1-300 Seconds Anneal Time Controlled Ambient for up to 4 Gases
配置
无配置
OEM 型号描述
未提供
文件

无文件