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MATTSON HELIOS
    说明
    Missing parts list
    配置
    After verifying with on-site personnel, it was confirmed that "the quartz inside the chamber is still intact and usable during shutdown.
    OEM 型号描述
    Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
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    MATTSON

    HELIOS

    verified-listing-icon

    已验证

    类别
    RTP/RTA

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    23093


    晶圆尺寸:

    12"/300mm


    年份:

    2007

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    Transaction Insured by Moov
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    类似上架物品
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    MATTSON HELIOS

    MATTSON

    HELIOS

    RTP/RTA
    年份: 2006状况: 二手
    上次验证26 天前

    MATTSON

    HELIOS

    verified-listing-icon
    已验证
    类别
    RTP/RTA
    上次验证: 60 多天前
    listing-photo-Y3x8GzuFg3-9cjoJbAQ_m5y-MtETmPY0FbSLwUKJORY-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1692/Y3x8GzuFg3-9cjoJbAQ_m5y-MtETmPY0FbSLwUKJORY/8add22058bbc4df888c94a993fa45d94_7a0a73c4702047a3bd72c7d5c275665e45005c_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    23093


    晶圆尺寸:

    12"/300mm


    年份:

    2007


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Missing parts list
    配置
    After verifying with on-site personnel, it was confirmed that "the quartz inside the chamber is still intact and usable during shutdown.
    OEM 型号描述
    Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
    文件

    无文件

    类似上架物品
    查看全部
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