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MATTSON HELIOS
    说明
    无说明
    配置
    RTP
    OEM 型号描述
    Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
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    verified-listing-icon

    已验证

    类别
    RTP/RTA

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    116732


    晶圆尺寸:

    12"/300mm


    年份:

    2010


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    MATTSON

    HELIOS

    verified-listing-icon
    已验证
    类别
    RTP/RTA
    上次验证: 60 多天前
    listing-photo-fcbf7f88cce1453fab61fd44be9d0374-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    116732


    晶圆尺寸:

    12"/300mm


    年份:

    2010


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    RTP
    OEM 型号描述
    Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
    文件

    无文件