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MATTSON HELIOS
    说明
    无说明
    配置
    Tool condition: tool is de-installed & stored at cleanroom Process:RTP Software verison 1. Sequencer :MCS1.6.2 2. Load port firware:VER 5.04 3. MMC: VxWorks 5.5.1 Handling Module 1.Signal Tower:Front 2.Wafer size:300mm 3.Configuration:3xFOUP 4.Carrier ID reader:Yes 5. sequencer:Yes 6.license:Yes 7.ionizer:Yes 8.Frequency Converter :Yes 9.Power SupplyIonisator 603N3:Yes 10.Linear Track Controller 616N3:setting 550rpm 11.Step Motor Linear Track  :Yes 12.VGA Data Switch  625S1:Yes 13.Cooling Station Sensors:Yes 14.Supply Filter:CIP3 & quartz blade 15.Robot Controller 616N1:Yes 16.Robot:Yes 17.Upper arm & Lower arm:Yes Upper: metal ; Low: Quartz 18.Distribution Box :Yes 19.Potentiometer R603 (FFU):Yes Process Module *2  1.Field Box:Yes 2.IGBT Box:Yes 3.Main Switch:Yes 4.O2 sensor module:Yes 5.O2 sensor display:Yes 6.Reactor Door:Yes 7.Door cylinder:Yes 8.Pyro chiller:Yes Only one under PM1 9.Control Rack:Yes 10.Filed Box Plate:Yes 11.Connector plate:Yes 12.Connector plate Control rack:Yes Gas box O2    150 SLM O2    2 SLM O2    20 SCCM O2    3 SCCM O2    200 SCCM O2    20 SLM N2    20 SLM N2    150 SLM N2    x N2H2    x H2    x H2    50 SLM NH3    30 SLM Ar    20 SLM Ar    150 SLM Sub-tool 1.Blower *2    Yes two chamber 2.Power rack    Yes Missing/Damaged Parts List: Missing parts- PCW meter Missing parts- PCW valve Please inspect tool to reconfirm
    OEM 型号描述
    Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
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    MATTSON

    HELIOS

    verified-listing-icon

    已验证

    类别

    RTP/RTA
    上次验证: 60 多天前
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    16694


    晶圆尺寸:

    12"/300mm


    年份:

    未知

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    类似上架物品
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    MATTSON HELIOS
    MATTSONHELIOSRTP/RTA
    年份: 2010状况: 二手
    上次验证60 多天前

    MATTSON

    HELIOS

    verified-listing-icon

    已验证

    类别

    RTP/RTA
    上次验证: 60 多天前
    listing-photo-g2UxQzfaTkelWLXWAvl0mq6oBFm6ILugqkKVB0oXyzo-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    16694


    晶圆尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    Tool condition: tool is de-installed & stored at cleanroom Process:RTP Software verison 1. Sequencer :MCS1.6.2 2. Load port firware:VER 5.04 3. MMC: VxWorks 5.5.1 Handling Module 1.Signal Tower:Front 2.Wafer size:300mm 3.Configuration:3xFOUP 4.Carrier ID reader:Yes 5. sequencer:Yes 6.license:Yes 7.ionizer:Yes 8.Frequency Converter :Yes 9.Power SupplyIonisator 603N3:Yes 10.Linear Track Controller 616N3:setting 550rpm 11.Step Motor Linear Track  :Yes 12.VGA Data Switch  625S1:Yes 13.Cooling Station Sensors:Yes 14.Supply Filter:CIP3 & quartz blade 15.Robot Controller 616N1:Yes 16.Robot:Yes 17.Upper arm & Lower arm:Yes Upper: metal ; Low: Quartz 18.Distribution Box :Yes 19.Potentiometer R603 (FFU):Yes Process Module *2  1.Field Box:Yes 2.IGBT Box:Yes 3.Main Switch:Yes 4.O2 sensor module:Yes 5.O2 sensor display:Yes 6.Reactor Door:Yes 7.Door cylinder:Yes 8.Pyro chiller:Yes Only one under PM1 9.Control Rack:Yes 10.Filed Box Plate:Yes 11.Connector plate:Yes 12.Connector plate Control rack:Yes Gas box O2    150 SLM O2    2 SLM O2    20 SCCM O2    3 SCCM O2    200 SCCM O2    20 SLM N2    20 SLM N2    150 SLM N2    x N2H2    x H2    x H2    50 SLM NH3    30 SLM Ar    20 SLM Ar    150 SLM Sub-tool 1.Blower *2    Yes two chamber 2.Power rack    Yes Missing/Damaged Parts List: Missing parts- PCW meter Missing parts- PCW valve Please inspect tool to reconfirm
    OEM 型号描述
    Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
    文件

    无文件

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