说明
无说明配置
200C - 1300C temperature Two process chambers Details are attached below. This tool was converted from a MATTSON Helios RF200 (300mm tool) to its current state of a MATTSON Helios C200 (200mm tool). Unique Wafer Stress Management Capabilities: -Wafer double-side heating for best wafer stress management -RTP process for different substrate thickness Superior Solution for Pattern-Loading Effect: -Wafer double-side heating coupled with proven DTEC control technology -Elimination of wafer-loading effect in RTP processes Wide RTP Applications: -200°C – 1300°C temperature range, from ultra-low -temperature NiSi anneal to ultra-high temperature -Wafer engineering -Best metal contamination performance for CMOS -Sensor fabrication -Excellent ambient control capability, O < 1 ppm -High power incandescent lamp, long lifetime High Productivity System Platform: -Two process chambers -High speed wafer transfer -Small footprint -More than 300 platforms installed worldwide Product Applications: -Power IC, CMOS Sensor, MEMS, Logic, LED: -Post-implant ion activation -Ultra-shallow-junction formation -Metal silicide formation -High temperature anneal Wafer Manufacturing: -High temperature wafer substrate annealOEM 型号描述
The Helios C200 RTP system combines superior technical performance with outstanding tool reliability. It is the ideal RTP solution for 200 mm semiconductor development and manufacturing.文件
类别
RTP/RTA
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68083
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MATTSON
HELIOS C200
类别
RTP/RTA
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68083
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available