说明
无说明配置
无配置OEM 型号描述
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.文件
无文件
ACCRETECH / TSK
A-WD-10A
已验证
类别
Scribing, Cutting, Dicing
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
47633
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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查看全部ACCRETECH / TSK
A-WD-10A
已验证
类别
Scribing, Cutting, Dicing
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
47633
晶圆尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.文件
无文件