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说明
AUTOMATIC DICNG SAW配置
无配置OEM 型号描述
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.文件
无文件
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
69279
晶圆尺寸：
未知
年份：
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
A-WD-10A
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
69279
晶圆尺寸：
未知
年份：
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
AUTOMATIC DICNG SAW配置
无配置OEM 型号描述
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.文件
无文件