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ACCRETECH / TSK A-WD-200T
  • ACCRETECH / TSK A-WD-200T
  • ACCRETECH / TSK A-WD-200T
说明
无说明
配置
无配置
OEM 型号描述
The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
文件

无文件

类别
Scribing, Cutting, Dicing

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

25744


晶圆尺寸:

未知


年份:

2005


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK

A-WD-200T

verified-listing-icon
已验证
类别
Scribing, Cutting, Dicing
上次验证: 60 多天前
listing-photo-6b42e9f5b2ce4da5a80bf4153bd33ec8-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/6b42e9f5b2ce4da5a80bf4153bd33ec8/561521fe937c40cfbe05473e00ad2526_4b62b671ae4d44539e8c1baf52003e8d45005c_f.jpeg
listing-photo-6b42e9f5b2ce4da5a80bf4153bd33ec8-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/6b42e9f5b2ce4da5a80bf4153bd33ec8/88f21bbe4b03460bb140148526b796c4_8cf41f42843246ed834df5bb7666b6db45005c_f.jpeg
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

25744


晶圆尺寸:

未知


年份:

2005


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
无配置
OEM 型号描述
The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
文件

无文件

类似上架物品
查看全部