说明
Packaging products/wafer dicing machines 6-8-10 inch plate配置
无配置OEM 型号描述
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.文件
无文件
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
103702
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ADVANCED DICING TECHNOLOGIES (ADT)
7900
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
103702
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Packaging products/wafer dicing machines 6-8-10 inch plate配置
无配置OEM 型号描述
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.文件
无文件