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Packaging products/wafer dicing machines 6-8-10 inch plate配置
无配置OEM 型号描述
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.文件
无文件
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
103702
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ADVANCED DICING TECHNOLOGIES (ADT)
7900
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
103702
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Packaging products/wafer dicing machines 6-8-10 inch plate配置
无配置OEM 型号描述
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.文件
无文件