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说明
无说明配置
无配置OEM 型号描述
Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor wafers. The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting.文件
无文件
DISCO
DFD-2D/8
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
92615
晶圆尺寸：
未知
年份：
未知
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Available
Money Back Guarantee
Available
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Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor wafers. The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting.文件
无文件