说明
wafer saw cutting machine配置
无配置OEM 型号描述
The Disco DFD6361 is a Fully Automatic Dicing Saw. It offers highly consistent and dependable cut quality through the new Synchro Spindle featuring superior radial rigidity. The DFD6361 enhances throughput in two distinct ways: DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.文件
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DISCO
DFD6361
类别
Scribing, Cutting, Dicing
上次验证： 19 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127037
晶圆尺寸：
未知
年份：
2010
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Logistics Support
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Money Back Guarantee
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Refurbishment Services
Available
说明
wafer saw cutting machine配置
无配置OEM 型号描述
The Disco DFD6361 is a Fully Automatic Dicing Saw. It offers highly consistent and dependable cut quality through the new Synchro Spindle featuring superior radial rigidity. The DFD6361 enhances throughput in two distinct ways: DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.文件
无文件