说明
The laser head is new. System is working condition.配置
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEM 型号描述
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.文件
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DISCO
DFL7161
已验证
类别
Scribing, Cutting, Dicing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115179
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFL7161
类别
Scribing, Cutting, Dicing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115179
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
The laser head is new. System is working condition.配置
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEM 型号描述
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.文件
无文件