说明
无说明配置
无配置OEM 型号描述
The DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser. It is manufactured by Disco Corporation. The maximum workpiece size is Φ300 mm and the processing range of the X-axis (Chuck table) is Φ310 mm with a moving speed of 1 ～ 600 mm/s.文件
无文件
DISCO
DFL7560L
已验证
类别
Scribing, Cutting, Dicing
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66630
晶圆尺寸：
未知
年份：
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFL7560L
已验证
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66630
晶圆尺寸：
未知
年份：
2018
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser. It is manufactured by Disco Corporation. The maximum workpiece size is Φ300 mm and the processing range of the X-axis (Chuck table) is Φ310 mm with a moving speed of 1 ～ 600 mm/s.文件
无文件