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DYNATEX DX-III
  • DYNATEX DX-III
  • DYNATEX DX-III
  • DYNATEX DX-III
  • DYNATEX DX-III
说明
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM
配置
Missing Hard Drive/Computer The rest of the tool is fully functional
OEM 型号描述
未提供
文件

无文件

verified-listing-icon

已验证

类别
Scribing, Cutting, Dicing

上次验证: 60 多天前

物品主要详细信息

状况:

Parts Tool


运行状况:

未知


产品编号:

19568


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

DYNATEX

DX-III

verified-listing-icon
已验证
类别
Scribing, Cutting, Dicing
上次验证: 60 多天前
listing-photo-o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo/cZPvPmqgy0SWd-abA0tvEq2eJixnnoC0kQRYsvj6TdU_20190315_091744_f
listing-photo-o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo/Y-yUmSKtozBFegpvkocNPNQDrJJOLrUeh9mb7-z-1Ws_20190315_091744_f
listing-photo-o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo/grZqNZec1-PUs5jj5NaAM7zxLWAITTAV87b8_-CR4Gc_20190315_091744_f
listing-photo-o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/o15o8kCMxe3Ik9hQSRiPyeSwH-T-7GNnNj66B7xtlKo/vN7Qj7I_hS31T_gLIgdC62TwWdm0Y9idZ_LjVfDo2Q0_20190315_091744_f
物品主要详细信息

状况:

Parts Tool


运行状况:

未知


产品编号:

19568


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM
配置
Missing Hard Drive/Computer The rest of the tool is fully functional
OEM 型号描述
未提供
文件

无文件