说明
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM配置
Missing Hard Drive/Computer The rest of the tool is fully functionalOEM 型号描述
未提供文件
无文件
DYNATEX
DX-III
已验证
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
19568
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DYNATEX
DX-III
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
19568
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM配置
Missing Hard Drive/Computer The rest of the tool is fully functionalOEM 型号描述
未提供文件
无文件