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说明
无说明配置
无配置OEM 型号描述
The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.文件
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PREFERRED
SELLER
类别
SEM / FIB
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
84145
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
HELIOS NANOLAB 600
类别
SEM / FIB
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
84145
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.文件
无文件