说明
• Field Proven 3D Vision Sensing Technology • High Resolution 3D sensing technology • Built-in Fiducial camera & lighting • Great for Demanding Assemblies • 3D Height, True Volume & Area measurements for CSPs, 0201s or small pad sizes • 3D shaded view for examining solder paste deposits • Registration Measurement • Bridge Detection for Fine Tune printer setup/monitor process drift • XML format output • Adjustable-width, clamping conveyor systems • CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive • Dimensions (h x w x d) 200 x 98 x 125 • Weight 860 kg (1900 lbs.) • Panel Size Capacity: Maximum 508 x 508 mm (20 x 20 in.) Minimum 101 x 40 mm (4 x 1.5 in.) • Maximum Panel Weight: 3 kg (6.6 lb.) • Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.) • Board Edge Clearance: Top 2.5 mm (0.10 in.) Bottom 3 mm (0.12 in.) • Underside Component Clearance: 25.4 mm (1 in.) • Conveyor Speed Range: 150-450 mm/sec (5.9-17.7 in/sec) • Conveyor Height: 889 to 990 mm (35 to 39 in.) • Laser Range Finder: 640-870 nm, 1mW max, (built into sensor) Class II • Maximum Inspection Area: 508 x 503 mm (20 x 19.5 in.) • Maximum Pad Size: in 5 x 10 mm • FOV (0.197 x 0.394 in.)配置
无配置OEM 型号描述
CyberOptics 100% 3D solder paste inspection system, the SE 300 ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of you line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control.文件
无文件
CYBER OPTICS
SE300 Ultra
已验证
类别
Solder Paste Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68919
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CYBER OPTICS
SE300 Ultra
类别
Solder Paste Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68919
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
• Field Proven 3D Vision Sensing Technology • High Resolution 3D sensing technology • Built-in Fiducial camera & lighting • Great for Demanding Assemblies • 3D Height, True Volume & Area measurements for CSPs, 0201s or small pad sizes • 3D shaded view for examining solder paste deposits • Registration Measurement • Bridge Detection for Fine Tune printer setup/monitor process drift • XML format output • Adjustable-width, clamping conveyor systems • CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive • Dimensions (h x w x d) 200 x 98 x 125 • Weight 860 kg (1900 lbs.) • Panel Size Capacity: Maximum 508 x 508 mm (20 x 20 in.) Minimum 101 x 40 mm (4 x 1.5 in.) • Maximum Panel Weight: 3 kg (6.6 lb.) • Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.) • Board Edge Clearance: Top 2.5 mm (0.10 in.) Bottom 3 mm (0.12 in.) • Underside Component Clearance: 25.4 mm (1 in.) • Conveyor Speed Range: 150-450 mm/sec (5.9-17.7 in/sec) • Conveyor Height: 889 to 990 mm (35 to 39 in.) • Laser Range Finder: 640-870 nm, 1mW max, (built into sensor) Class II • Maximum Inspection Area: 508 x 503 mm (20 x 19.5 in.) • Maximum Pad Size: in 5 x 10 mm • FOV (0.197 x 0.394 in.)配置
无配置OEM 型号描述
CyberOptics 100% 3D solder paste inspection system, the SE 300 ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of you line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control.文件
无文件