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TEL / FSI ZETA
    说明
    CHEMICAL RESIST STRIP
    配置
    无配置
    OEM 型号描述
    The ZETA Surface Conditioning System is a fully automated centrifugal spray processor designed for advanced, batch cleaning, etching and stripping applications on 200-mm and 300-mm wafers. The system is completely closed, providing greater process control and repeatability in an extremely clean environment. Compared to traditional wet cleaning technologies, the ZETA system uses less fab space and chemicals and operates at a much lower cost. It performs a variety of etching applications, including patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.
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    verified-listing-icon

    已验证

    类别
    Spray Solvent / Acid

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    127887


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    TEL / FSI

    ZETA

    verified-listing-icon
    已验证
    类别
    Spray Solvent / Acid
    上次验证: 30 多天前
    listing-photo-9eecd38f271241f69b9a9ec61ddf6d7c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    127887


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    CHEMICAL RESIST STRIP
    配置
    无配置
    OEM 型号描述
    The ZETA Surface Conditioning System is a fully automated centrifugal spray processor designed for advanced, batch cleaning, etching and stripping applications on 200-mm and 300-mm wafers. The system is completely closed, providing greater process control and repeatability in an extremely clean environment. Compared to traditional wet cleaning technologies, the ZETA system uses less fab space and chemicals and operates at a much lower cost. It performs a variety of etching applications, including patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.
    文件

    无文件