说明
Dual SRD 20170324 8300 GHP 12724/12725配置
无配置OEM 型号描述
This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. Introduced in 1979, over 25,000 units have shipped worldwide. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. FEATURES Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency Dry - Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design Flexible - Easy to change rotors for simple reconfiguration to match any array of applications Fast - A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime RELATED PROCESSES AND TECHNOLOGIES PROCESSES SUPPORTED Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry文件
无文件
SEMITOOL
SRD-8300S
已验证
类别
SRD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
55502
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMITOOL
SRD-8300S
类别
SRD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
55502
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Dual SRD 20170324 8300 GHP 12724/12725配置
无配置OEM 型号描述
This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. Introduced in 1979, over 25,000 units have shipped worldwide. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. FEATURES Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency Dry - Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design Flexible - Easy to change rotors for simple reconfiguration to match any array of applications Fast - A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime RELATED PROCESSES AND TECHNOLOGIES PROCESSES SUPPORTED Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry文件
无文件