说明
i-Line Wide-Field Stepper配置
Tool is operating in clean room. Labelled as Collateral Asset. Pictures: Please see. Configurations will be provided. Additional performance data will be collected. Missing or damaged parts: Not reported.OEM 型号描述
NSR-SF130, a scan-field i-line stepper with high throughput and extremely low cost of ownership. The system makes use of leading-edge lens technology to achieve the same wide exposure field (26×33 mm) as DUV scanners, making it ideal for mix and match applications. The NSR-SF130, Nikon’s fifth new semiconductor systems announced in 2003, achieves a resolution of 280 nm or better and boasts a throughput of 120 wafers/hour for 300 mm wafers. The system combines superior performance with the lowest cost of ownership to help reduce semiconductor manufacturing costs.文件
无文件
NIKON
NSR-SF130
已验证
类别
Steppers & Scanners
上次验证: 19 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
11980
晶圆尺寸:
12"/300mm
年份:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部NIKON
NSR-SF130
类别
Steppers & Scanners
上次验证: 19 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
11980
晶圆尺寸:
12"/300mm
年份:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
i-Line Wide-Field Stepper配置
Tool is operating in clean room. Labelled as Collateral Asset. Pictures: Please see. Configurations will be provided. Additional performance data will be collected. Missing or damaged parts: Not reported.OEM 型号描述
NSR-SF130, a scan-field i-line stepper with high throughput and extremely low cost of ownership. The system makes use of leading-edge lens technology to achieve the same wide exposure field (26×33 mm) as DUV scanners, making it ideal for mix and match applications. The NSR-SF130, Nikon’s fifth new semiconductor systems announced in 2003, achieves a resolution of 280 nm or better and boasts a throughput of 120 wafers/hour for 300 mm wafers. The system combines superior performance with the lowest cost of ownership to help reduce semiconductor manufacturing costs.文件
无文件