说明
无说明配置
无配置OEM 型号描述
The Ultratech TITAN II is a type of wafer stepper that belongs to the Ultratech series of lithography systems. It is capable of handling wafers that range in size from 4 inches to 8 inches, and it has a reticle size of 5 x 5 inches. The system has a projection ratio of 1:1, a lens resolution of 2 micrometers, and a field size of 44 millimeters by 22 millimeters. Additionally, the TITAN II includes a reticle library that has 12 slots and a bar code reader. It also has a stage with a monolithic structure and linear motor drive. The system is equipped with active air isolation to control vibrations and has global alignment accuracy of 120 nanometers in just 3 seconds. The imaging and lens system can achieve feature sizes as small as 2.0 micrometers, with lens distortion of 120 nanometers and colinearity of 80 nanometers. The maximum image area is 55 millimeters by 18 millimeters, and the exposure spectrum is broadband, ranging from 390 nanometers to 450 nanometers. The wafer plane intensity is greater than 1200 milliwatts per square centimeter, with uniformity of 2.0%.文件
无文件
类别
Steppers & Scanners
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72673
晶圆尺寸：
6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
VEECO / ULTRATECH
TITAN II
类别
Steppers & Scanners
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72673
晶圆尺寸：
6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Ultratech TITAN II is a type of wafer stepper that belongs to the Ultratech series of lithography systems. It is capable of handling wafers that range in size from 4 inches to 8 inches, and it has a reticle size of 5 x 5 inches. The system has a projection ratio of 1:1, a lens resolution of 2 micrometers, and a field size of 44 millimeters by 22 millimeters. Additionally, the TITAN II includes a reticle library that has 12 slots and a bar code reader. It also has a stage with a monolithic structure and linear motor drive. The system is equipped with active air isolation to control vibrations and has global alignment accuracy of 120 nanometers in just 3 seconds. The imaging and lens system can achieve feature sizes as small as 2.0 micrometers, with lens distortion of 120 nanometers and colinearity of 80 nanometers. The maximum image area is 55 millimeters by 18 millimeters, and the exposure spectrum is broadband, ranging from 390 nanometers to 450 nanometers. The wafer plane intensity is greater than 1200 milliwatts per square centimeter, with uniformity of 2.0%.文件
无文件