说明
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal system配置
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEM 型号描述
未提供文件
无文件
类别
Support Equipment
上次验证： 5 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
154854
晶圆尺寸：
未知
年份：
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SCIENTECH
Pyxis 3001-TDB
类别
Support Equipment
上次验证： 5 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
154854
晶圆尺寸：
未知
年份：
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal system配置
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEM 型号描述
未提供文件
无文件